SIMHUB
Package modelling
Read upstream EDA designs and use parametric tools for common package forms.
Product portfolio
Package thermal warpage analysis · SimWE
Chip & package multiphysics
Simdroid-IC
Technology by SimWE
Look beyond temperature in advanced packaging.
An integrated thermal, structural and electromagnetic simulation product for advanced chip packaging, developed on Simdroid’s shared architecture.
Discuss Simdroid-ICBUILT FOR YOUR WORK
From question to insight.
Chip and package engineers assessing thermal performance, mechanical reliability and electromagnetic behaviour.
Coupled analysis
Investigate thermal, stress and electromagnetic effects within one workflow.
Design evaluation
Review temperature, warpage and field distributions before refining the package.
Application areas
AN EVALUATION WORKFLOW
Prepare. Analyse. Review.
Prepare
Package geometry, materials, process information and loads.
Analyse
Configure the required physical fields and their coupling.
Compare
Examine thermal maps, deformation and electromagnetic results.
The workflow above is an evaluation outline. Confirm the required modules, interfaces and version for your application.
Product information from SimWEAPPLICATIONS IN PRACTICE
Start with your use case
Explore the engineering workflow
Discuss your package geometry, boundary conditions and target outputs with Simhub.
Plan an evaluation