CUSTOMER APPLICATION

Cooling precision semiconductor equipment

SiCarrier

All case studies

The engineering question

High-power components inside compact inspection equipment created local overheating risks. The team needed a practical way to assess heat paths before hardware iteration.

The approach

Simdroid-EC imported equipment CAD and used voxelisation to prepare the model. Coupled heat-transfer analysis revealed temperature, airflow and pressure patterns for layout and cooling-path decisions.

What the source reports

SimWE reports a more efficient modelling process and earlier identification of thermal risks. The project illustrates a thermal-design workflow; its results are specific to this equipment.

Equipment thermal result published in the Xinkailai project story
Equipment thermal result published in the Xinkailai project story. Source: SimWE.

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