Redesigning cooling in a payment terminal

The engineering question

A compact payment-terminal design encountered overheating during testing. The hardware team needed to understand internal temperatures before further revisions.

The approach

Simdroid-EC modelled the terminal and its heat-transfer paths. Engineers used the results to revise PCB component placement, thermal materials and enclosure features.

What the source reports

The source reports completion of the product iteration and the establishment of a simulation workflow. Published performance claims relate to this particular project.

Read the source

English summary prepared by Simhub from SimWE’s publication. The project is attributed to the organisations named above.

SimWE original · Chinese