Thermal analysis for compact AI terminals

The engineering question

Variable compute loads and restricted internal space made heat dissipation a key design question for AI-enabled terminals.

The approach

The team used CAD and ECAD inputs with Simdroid-EC to analyse coupled heat transfer and locate thermal bottlenecks. Simulation informed revisions to the cooling structure.

What the source reports

The source reports that the analysed design met component junction-temperature requirements and that temperature predictions agreed closely with measurements.

Read the source

English summary prepared by Simhub from SimWE’s publication. The project is attributed to the organisations named above.

SimWE original · Chinese