Finding hotspots inside smart audio hardware

The engineering question

Increasing component density and power made experience-based cooling design harder. Thermal problems could emerge late in prototype testing.

The approach

HS Technology selected Simdroid-EC to build and import thermal models, process geometry and solve internal flow and heat transfer under demanding operating conditions.

What the source reports

The source describes using temperature maps to compare cooling concepts before structural design was finalised, reducing repeated prototype iterations.

Read the source

English summary prepared by Simhub from SimWE’s publication. The project is attributed to the organisations named above.

SimWE original · Chinese